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26 – 28 June 2019 Shanghai, China More Info

Poster Gallery Poster session for Thursday

Thursday, 27 June 2019
Chairperson: Norbert Pluschke, Semikron, Hongkong, China

A new, intelligent power module with higher power density and smallest package size

Sungmo Young, Infineon Technologies Korea, South Korea

To keep pace with higher power density requirements, two technical challenges should be resolved for power modules comprised of IGBTs and diodes. The IGBTs and diodes have to provide better performance in terms of static and dynamic losses. A new package is also necessary to meet the isolation distance and mounting methods used. This paper introduces a new IPM offering a three-phase inverter up to 20 A in the smallest available, fully isolated, and thermally enhanced package.

Application introduction of a small IPM for inverter washing machine

Xiaoling Wang, Mitsubishi Electric & Electronics, China

This paper present the design points of a small IPM from Mitsubishi electric SLIMDIP series of Dual In-line Package intelligent power module  for inverter washing machine application. By adopting high performance 2nd Gen. RC-IGBT chip and optimized package design, SLIMDIP achieved higher performance and lower cost which is a suitable product for inverter washing machine application. For inverter washing machine thermal design, power cycle life are very important for the reliable operation of DIPIPM which may operate with natural wind cooling heat-sink and frequent thermal shock . In this paper, SLIMDIP features, circuit design, power loss simulation, power cycle life evaluation are introduced. Example is given to analyze how to design and evaluate SLIMDIP-S for inverter washing machine application.

A Transmission Oil Pump Driver Design

Shinian Li, Infineon Integrated Circuit, China

Electronization is an essential trend in automotive while it also brings many worries like failure of elements. In this paper, a transmission oil pump electronic driver using Infineon embedded power ICs (ePower) and the GMR angle sensor TLE5009 is introduced. The general FOC motor control solution is implemented and the sensorless algorithm is also considered for the sensor failure condition. Many tests, like startup in different cases, the motor control angle shift from angle sensor to flux estimation and the system stabilities with fast varying inputs, are conducted to prove the advantages.

Increasing discrete IGBTs power density performance by improving thermal design in welding machines

Liwei Zhou, Infineon Technologies China Co.,Ltd, China

This paper presents an improved solution for welding machines power supply typically using IGBT modules.  The solution is based on a well-known thermal design concept where, with the purpose of increasing the heat dissipation, the discrete IGBTs without any electrical isolation are directly mounted on the heatsink.  This unconventional thermal design approach increases power density and enables higher output current with smaller current rating devices hence, allows to extend the use range of discrete IGBTs to power levels typically achieved by IGBT modules, reducing the cost of welding machines.

Sintered Silver Interconnects for Traction Inverter Assembly

Gyan Dutt, Alpha Assembly Solutions, United States

Electric vehicle driving range and cost are directly related to the power density (KW/L) and efficiency ($/KW) of the traction power module (and hence the inverter). The state-of the-art IGBT modules suffer from several packaging limitations – high parasitic impedance, poor thermal dissipation, and creep deformation of aluminum wire-bonds; high temperature degradation of die attach and heat-sink attach thermal impedance. Interestingly, most of these issues can be traced to poor selection of the interconnect layers in the inverter assembly. In fact, it has widely reported that interconnect layers account for >50% of the thermal impedance of the entire assembly stack.

Silver sintering offers a proven technology to overcome many of these thermal dissipation and high temperature stability challenges associated with the power module interconnects (die attach, wire-bonds and heat sink attach). During sintering the silver particles form inter-metallic free diffusion bond (in the bulk as well as the interfaces) - resulting in a dense microstructure that is highly stable (against high temperature and cyclic fatigue) and provides very low thermal resistance.

A Quick PCB Thermal Calculation for Power Electronic Devices with Exposed Pad Packages

Wenjing Zhang, ON Semiconductor, China

Thermal design of PCBs in electronic systems is critical to maintain device operating temperatures below specified limits. Although the predictions from full-field CFD simulations are accurate, the computational cost and model generation time could be fairly high. Thus, it is preferable to use a quick estimation tool to design a preliminary layout of PCBs with different heat-dissipating components.

Different from some of the existing cooling packaging options in the market today, ON Semiconductor’s exposed-pad packaging solution offers standard lead-frame based board mounting in a fully encapsulated DFN and QFN molded package, minimizing the thermal difference between the device and the PCB while offering near zero parasitic inductance with its layout friendly footprint.

The present methodology does not rely on accurate CFD modeling. It can be extended to forced convection and other PCB constructions simply by adjusting the film coefficient values and knowledge of how the board going to be constructed (e.g. number and thickness of metal layers). A calculator using this methodology can be developed as a stand-alone or a web-based application, and would be valuable when initially laying out multiple components on PCB, prior to undertaking a computationally expensive detailed CFD simulation of the entire PCB with all components.

Highly Reliable Protection of Power Module for Automotive Inverter  Application

Baoqi Wang, Mitsubishi Electric & Electronics, China

Eco-friendly vehicles such as xEV(HEV,PHEV,EV etc) will be spread rapidly. As the core component of xEV inverter, IGBT power module is the important part to determine vehicle performance. So higher reliable protection of power device is requested to maximize current output capability and to make vehicle running smoothly. Mitsubishi Electric had developed automotive IGBT module with on-chip current and temperature sensor. This paper mainly introduces how to make a protection solution by using this kind of high reliability on-chip current and temperature sensing function with driver IC to achieve more accurate and timely protection in automotive inverter application. At the same time, current output capability could also be maximized by monitoring on-chip temperature and on-chip current.

Reactive Power Sharing using modified Virtual Impedance and Local load measurement for Islanded Microgrid

Javed Akhtar Hussain, CYG SUNRI Co.,Ltd, China

This paper presents a method for reactive power sharing in microgrid using modified virtual impedance. The paper presents both theoretical calculation as well as simulation and experimental results.

IGBT Failure Analysis In the Praxis

Dan Zhu, Semikron Electronics, China

IGBTs are more and more widely used in our life, from traditional application such as motor drives, inverter, UPS to renewable energy as wind power, solar energy to electric vehicles shuttling on the road. IGBT, like the heart of human body, occupies the most important position in the whole system and completes the conversion of electric energy. In the process of using it, we will inevitably encounter the problem of IGBT failure. How to analyze the problem, find the root cause and avoid the problem in the future application? Improving the reliability of the product has become a major topic for R&D engineers.This paper will show you the advanced failure analysis method and comprehensive typical failures of semiconductors.

Design of 3 MHz Flyback Converter for Half-Bridge GaN HEMT Gate Driver Power Supply

Ziwei Ouyang, Technical University of Denmark, Denmark

With the development of wide-bandgap power semiconductor such as SiC MOSFETs and GaN HEMTs, a higher switching frequency is easy to be implemented, which brings a significant reduction of size for dc-dc converters. However, the bulky isolated power supplies for gate drivers limit the further increasing of power density. In order to address the problem an isolated power converter for a half-bridge configuration of GaN devices is designed and built to substitute conventional commercial isolated power supply modules. In this paper the detailed design procedures are presented and the circuit design considerations including components selected, power stage design and magnetics implementation are discussed. The magnetic core with newest low-loss Ferrite material ML91S is selected and used to build a coupling inductor. The converter works at 3MHz and owns two isolated outputs, which can generate 0.5W each. The experimental results verify the design procedures and the efficiency of prototype is 70% with wire-based inductor.