12:40-14:00 Thursday, 27 June 2019
Chairperson: Norbert Pluschke, Semikron, Hongkong, China
A new, intelligent power module with higher power density and smallest package size
To keep pace with higher power density requirements, two technical challenges should be resolved for power modules comprised of IGBTs and diodes. The IGBTs and diodes have to provide better performance in terms of static and dynamic losses. A new package is also necessary to meet the isolation distance and mounting methods used. This paper introduces a new IPM offering a three-phase inverter up to 20 A in the smallest available, fully isolated, and thermally enhanced package.
Sungmo Young received B.S. and M.S. degrees from Hanyang University, Seoul, Republic of Korea, in 1998 and 2000, respectively. Since 2000, he has been an application engineer of power semiconductors. He is currently working as IPM technical marketing at Infineon Technologies Korea.
Application introduction of a small IPM for inverter washing machine
This paper present the design points of a small IPM from Mitsubishi electric SLIMDIP series of Dual In-line Package intelligent power module for inverter washing machine application. By adopting high performance 2nd Gen. RC-IGBT chip and optimized package design, SLIMDIP achieved higher performance and lower cost which is a suitable product for inverter washing machine application. For inverter washing machine thermal design, power cycle life are very important for the reliable operation of DIPIPM which may operate with natural wind cooling heat-sink and frequent thermal shock . In this paper, SLIMDIP features, circuit design, power loss simulation, power cycle life evaluation are introduced. Example is given to analyze how to design and evaluate SLIMDIP-S for inverter washing machine application.
Xiaoling Wang works for MITSUBISHI ELECTRIC & ELECTRONICS (SHANGHAI) CO., LTD as a Field Application Engineer since 2007. The main job responsibility is focusing on the application and promotion of power devices such as IGBTs and IPMs in China.
Worked as a R&D engineer for Qingdao Haier A/C Electronic CO., LTD from 1997 to 2002.
Increasing discrete IGBTs power density performance by improving thermal design in welding machines
This paper presents an improved solution for welding machines power supply typically using IGBT modules. The solution is based on a well-known thermal design concept where, with the purpose of increasing the heat dissipation, the discrete IGBTs without any electrical isolation are directly mounted on the heatsink. This unconventional thermal design approach increases power density and enables higher output current with smaller current rating devices hence, allows to extend the use range of discrete IGBTs to power levels typically achieved by IGBT modules, reducing the cost of welding machines.
Mr. Liwei Zhou, graduated from Shanghai Maritime University with Master’s degree on Power Electronics & Electric Drives in 2007. Then he worked for Shanghai Electric Xantrex Power Electronics Co. Ltd. for three years as R&D engineer responsible for wind power converter development and localized production.
In 2010, he joined GE (China) Technology Center as the product engineer, providing technical support to wind turbine production line and failure mode analysis on component level and engaged in LVRT retrofit solution making for GE wind turbines.
In August of 2012, he joined Infineon Technologies China Co. Ltd. as a senior application engineer and has served Infineon for ~7 years till now. He is currently responsible for IGBT modules and discrete technical support to the customers located in Middle & East of China area.
Sintered Silver Interconnects for Traction Inverter Assembly
Electric vehicle driving range and cost are directly related to the power density (KW/L) and efficiency ($/KW) of the traction power module (and hence the inverter). The state-of the-art IGBT modules suffer from several packaging limitations – high parasitic impedance, poor thermal dissipation, and creep deformation of aluminum wire-bonds; high temperature degradation of die attach and heat-sink attach thermal impedance. Interestingly, most of these issues can be traced to poor selection of the interconnect layers in the inverter assembly. In fact, it has widely reported that interconnect layers account for >50% of the thermal impedance of the entire assembly stack.
Silver sintering offers a proven technology to overcome many of these thermal dissipation and high temperature stability challenges associated with the power module interconnects (die attach, wire-bonds and heat sink attach). During sintering the silver particles form inter-metallic free diffusion bond (in the bulk as well as the interfaces) - resulting in a dense microstructure that is highly stable (against high temperature and cyclic fatigue) and provides very low thermal resistance.
Gyan Dutt works for Alpha as Global Portfolio Manager for Die Attach Solutions. He is responsible for the planning, organization and implementation of ALPHA® product portfolio for Die Attach for power modules, inverters and LED applications. He has more than 15 years of experience in marketing, product development and applications engineering roles in semiconductor packaging in the US and Asia-Pacific Regions. He has an MS in Polymer Engineering from the University of Tennessee in Knoxville and an MBA from the University of California in Los Angeles.
A Quick PCB Thermal Calculation for Power Electronic Devices with Exposed Pad Packages
Thermal design of PCBs in electronic systems is critical to maintain device operating temperatures below specified limits. Although the predictions from full-field CFD simulations are accurate, the computational cost and model generation time could be fairly high. Thus, it is preferable to use a quick estimation tool to design a preliminary layout of PCBs with different heat-dissipating components.
Different from some of the existing cooling packaging options in the market today, ON Semiconductor’s exposed-pad packaging solution offers standard lead-frame based board mounting in a fully encapsulated DFN and QFN molded package, minimizing the thermal difference between the device and the PCB while offering near zero parasitic inductance with its layout friendly footprint.
The present methodology does not rely on accurate CFD modeling. It can be extended to forced convection and other PCB constructions simply by adjusting the film coefficient values and knowledge of how the board going to be constructed (e.g. number and thickness of metal layers). A calculator using this methodology can be developed as a stand-alone or a web-based application, and would be valuable when initially laying out multiple components on PCB, prior to undertaking a computationally expensive detailed CFD simulation of the entire PCB with all components.
Wenjing Zhang, Ph.D. works as Principal Application Engineer at ON Semiconductor in the DC-DC Power Solutions Business Unit. His field of expertise includes switch-mode power supplies and power semiconductor devices electrical-thermal modeling. SPICE/Matlab simulations are also a strong-part of his knowledge. He has over 10 years of power semiconductor industry experience. He received his Ph.D. in Microelectronics and Solid State Electronics from The Graduate University of Chinese Academy of Sciences, China.
Highly Reliable Protection of Power Module for Automotive Inverter Application
Eco-friendly vehicles such as xEV(HEV,PHEV,EV etc) will be spread rapidly. As the core component of xEV inverter, IGBT power module is the important part to determine vehicle performance. So higher reliable protection of power device is requested to maximize current output capability and to make vehicle running smoothly.
Mitsubishi Electric had developed automotive IGBT module with on-chip current and temperature sensor. This paper mainly introduces how to make a protection solution by using this kind of high reliability on-chip current and temperature sensing function with driver IC to achieve more accurate and timely protection in automotive inverter application. At the same time, current output capability could also be maximized by monitoring on-chip temperature and on-chip current.
Baoqi Wang works for MITSUBISHI ELECTRIC & ELECTRONICS (SHANGHAI) CO., LTD as a Field Application Engineer since 2016. The main job responsibility is focusing on the application and promotion of EV power devices in China.
Reactive Power Sharing using modified Virtual Impedance and Local load measurement for Islanded Microgrid
This paper presents a method for reactive power sharing in microgrid using modified virtual impedance. The paper presents both theoretical calculation as well as simulation and experimental results.
Javed Akhtar Hussain is Electrical Engineer now working with CYG SUNRI CO. LTD as solution engineer for renewable energy products. In 2017, he did his postgraduate degree in Electrical Engineering from Xian Jiaotong University with major in Power electronics. He worked with distinguished IEEE fellow Prof. Liu JinJun in distributed control of microgrid team. His area of research is control of microgrid especially power sharing issue.
IGBT Failure Analysis In the Praxis
IGBTs are more and more widely used in our life, from traditional application such as motor drives, inverter, UPS to renewable energy as wind power, solar energy to electric vehicles shuttling on the road. IGBT, like the heart of human body, occupies the most important position in the whole system and completes the conversion of electric energy. In the process of using it, we will inevitably encounter the problem of IGBT failure. How to analyze the problem, find the root cause and avoid the problem in the future application? Improving the reliability of the product has become a major topic for R&D engineers.This paper will show you the advanced failure analysis method and comprehensive typical failures of semiconductors.
The speaker has studied the advanced semiconductor analysis methods both China and international and systematically summarized and collated them in her work. She has more than 10 year experience about how to improve in both product quality and application.