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PCIM
26 – 28 June 2019 Shanghai, China More Info

Power Electronics in Electric Vehicle Application

27th June 2018, Wednesday
Chairperson: Prof. Xuhui Wen, Chinese Academy of Science, China

14:00 High performance high power modules for MV converter application

Xiankui Ma, Mitsubishi Electric & Electronics (Shanghai) Co., Ltd., China

With the new technologies development, like chip technology, and package technology, new X series HVIGBT has excellent performance of power loss reduction and higher operation junction temperature as 175deg.C. Then the rated current with the conventional package is increased, which is accordingly improving the capacity for MV converter, like mining purpose inverter, MV wind power converter and VVVF, etc.
14:25 Compact regenerative elevator drive with one unique power module

Changsheng Ye, Semikron Electronics (Zhuhai) Co., Ltd. Shanghai Branch, China

The trend that small cities have been growing into large cities or metropolises seems inevitable. It will challenge us in many aspects such as energy supply, environmental improvement and pollution control, so energy saving and emission reduction has been put into an even important position. Technology innovation and development are injecting new impetus and providing us new thoughts in city management and construction. Elevator as high electricity consumption equipment is a necessity in our daily life of city, so, under this background, more and more elevator companies are paying attention to technology of energy recycling. Drive as heart of elevator associates with the whole system’s reliability, lifetime and electricity performance, which are always supposed to be improved, but any improvement should also be cost efficient because of increasing strong market competition. So the high requirement have been bringing up big challenge for components suppliers and system designers. How to utilize available resources to achieve an optimal drive design and balance performance and cost are most important things we need to consider now.
14:50 1,700V IGBT module with newly developed 7th Generation technology

Song Chen, Fuji Electric (China) Co.,Ltd, China

The 7th Generation 1,700V IGBT modules have been developed based on concepts of higher power density and higher reliability. To realize the concepts, many advanced technologies are applied such as power dissipation improvement by newly developed 7th  generation IGBT and FWD Si dies, lower thermal resistance by high thermal conductive thinner AlN ceramics and upgrade the operation temperature (maximum junction temperature) up to 175deg.C.
15:30 Best fit between baseplate geometry and ceramic thickness to achieves excellent thermal performance

Song Shen, Infineon Technologies(China) Co., Ltd, China

With the electrification of vehicles, the  increasing demand of renewable energies and the need of reducing energy consumption, the demand of power electronics increases. To satisfy this demand it is important to offer IGBT modules with materials from multiple sources and with similar cost performance ratio to allow high flexibility to customers. In this publication, a comparison between two different EconoDUAL™ 3 modules with different ceramic and baseplate geometry will be presented.
15:55 Investigation of power cycling capability of a novel Cu wires bonded interconnection system

Nan Jiang, Chemnitz University of Technology, Germany

In order to improve the lifetime of power modules, the chip top-side connections can be changed from Al wires to Cu wires. However, the Cu wire bonding technology requires the change of chip top-metallization to a more robust metal, such as copper, in order to avoid the damage of the chip during the ultrasonic welding process for the stiff Cu bond wires. Unfortunately, chips metallized with copper is not well available in the power semiconductor industry. Therefore, Danfoss Bond Buffer (DBBTM) was developed to enable the ultrasonic welding process for Cu wires on Al-metallized chips with common plating of Ni/Au, Pd or Ag. Additionally, Heraeus Electronics cooperates with Danfoss Silicon Power has presented a novel Cu bond interconnection system: Die Top System (DTS®) to the market.
Power cycling test is regarded as the most important accelerated test to investigate the reliability performance of power devices. However, the impact of test parameters and control strategies makes the PC test one of the most complicated reliability test to perform. Recently, Heraeus Electronics cooperates with Chemnitz University of Technology makes a great achievement in the field of PC test. In this work, power cycling tests were performed for DTS® samples and standard samples.
The power cycling performance showed an increase of at least 55 times compared to samples bonded with Al wires at the test conditions of ΔTj=125 K and ton=1 s. The different reliability behaviors of different DTS® were observed.