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F56A1066

All PCIM Asia Conference presentations are available on proceedings. Please see the summaries and table of contents for an overview of the articles included.

E-Proceedings of PCIM Asia 2021  RMB 2,000
E-Proceedings of PCIM Asia 2020  RMB 800
E-Proceedings of PCIM Asia 2015-2019 RMB 750

> Summary Proceedings 2021

Earlier editions are also available, please contact us and we will be happy to assist you.

Presentation PowerPoint 2021

F56A1180

Keynote

Top Ten Technology Trends of Huawei Digital Energy
Xiaofei Zhang
, Huawei Digital Energy, CN

High Power Devices

New 5.2kV StakPak Platform with Innovative Second Generation BIGT chip
Luca De Michielis
, Boni Boksteen, Evgeny Tsyplakov, Makan Chen, Daniel Prindle, Franc Dugal, Wolfgang Amadeus Vitale, Andreas Baschnagel, Gontran Pâques, Hitachi ABB Power Grids, Semiconductors, Switzerland

Increasing in the Output Power of IGBT Modules by Applying RC-IGBT Technology for High-Power Applications
Yuta Ebukuro
, Akio Yamano, Mitsuhiro Kakefu,Yuki Oda, Kaname Mitsuzuka, Seiji Momota, Taichi Itoh, Souichi Okita, Shinichi Yoshiwatari,Yasuyuki Kobayashi, Fuji Electric Co. Ltd., Japan

Easy-to-Scale Paralleling for IGBTs in Renewable Energy Application
Jianlong Chen
, Hao Wang, Power Integrations, China
Karsten Fink, Power Integrations GmbH, Germany

An Improved Performance of High Voltage RCIGCT for Applications up to 5.3kVDC
Umamaheswara Reddy Vemulapati
, Thomas Stiasny, Christian Winter, Chiara Corvasce, Hitachi ABB Power Grids Ltd., Switzerland
Matthias Lüscher, ABB Switzerland Ltd., Switzerland

High Power Density Converter

11 kW High-efficiency bidirectional CLLC converter with 1200 V SiC MOSFET
Sanbao Shi
, Rui Chen, Cheng Zhang, Infineon Technology Xian, China
Wei Shi, Infineon Technologies Austria AG, Austria

Volume Optimization of a 300kW MMC based DC-DC Converter for a DC Grid Connected Agricultural Machine
Hafiz Kashif Iqbal
, Pedro Leal dos Santos, Jawad Ismail, Steven Liu, Technical University of Kaiserslautern, Germany

Improvement of SCSOA, I2 t and reliability of in-vehicle power modules by RC-IGBT and leadframe structure
Tomohiro Isono
, Hayato Nakano, Akio Kitamura, Daisuke Inoue, Souichi Yoshida, Fuji Electric Co., Ltd., Japan

Optimized power module set for ESS and Solar under consideration of power factor -1/+1
Manyuan Zhao
, Changsheng Ye, SEMIKRON Electronics (Zhuhai) Co., Ltd., China

Advanced Power Devices

Fabrication and characterization of 3.3kV SiC MOSFET with embedded Junction Barrier Schottky Diode
Changwei Zheng
, Qijun Liu, Yafei Wang, Yachao Ma, Lele Li, Wuyue Lu, Chengzhan Li, State Key Laboratory of Advanced Power Semiconductor Devices, Zhuzhou CRRC Times Semiconductor Co., LTD, China

Advanced Edge Termination Design for 1200V Rated Thin Wafer Fast Recovery Diodes Shows Lower Leakage Current and Higher Operating Temperature up to 200°C 
Pengfei Liu
, Rongzhen Qin, Wei Hu, Mengjie Wang, Qiang Xiao, Haihui Luo, State key Laboratory of Advanced Power Semiconductor Devices, Zhuzhou CRRC Times Semiconductor Co. Ltd., China

Investigation on electrical characteristic of 3.3kV SiC MOSFET with integrated SBD
Guan Song
, Yafei Wang, Ximing Chen, Chenzhan Li, State key Laboratory of Advanced Power Semiconductor Devices, Zhuzhou CRRC Times Semiconductor Co., LTD, China

New Developed 1000A/6500V IGBT Module Based on TMOS+ IGBT and PIC FRD Technology
Feiyu Zhou
, Hui Wang, Liheng Zhu, Pengfei Liu, Haibo Xiao, Rongzhen Qin, Qiang Xiao, Haihui Luo, State key Laboratory of Advanced Power Semiconductor Devices, Zhuzhou CRRC Times Semiconductor Co., LTD, China

A Flexible, Physically based SPICE Model for the JFET Resistance in Silicon Carbide and Super-Junction MOSFETs
Kan Jia
, Yunpeng Xiao, onsemi, China
Petr Betak, Jaromir Foff, Jiri Lehocky, Dan Zurek, onsemi, Czech Republic Canzhong He, James Victory, onsemi, USA

Power Converter and Motion Control

AC/DC converter for aircraft power supply system
Sorokin Dmitriy
, Sergey Volskiy, Moscow aviation institute (National Research University), Russia
N. V. Kuznetsov, Institute for problems in mechanical engineering RAS, Russia
N. V. Kuznetsov, M. V. Yuldashev, R. V. Yuldashev, Saint-Petersburg State University, Russia

A Suppressed Switching Noise Full Bridge Inverter with Constant Switching Frequency Operation
Atsushi Hirota
, National Institute of Technology, Akashi College, Japan

Characterizing the Output Load Transient Based on a New Output Filter Circuit Extraction for CPU VRM Design
Richard(Hua) Yang
, Texas Instruments, China

Introduction of DIPIPM failure analysis for inverter air conditioner application
Xiaoling Wang
, Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China Junxiang Zhang, Mitsubishi Electric GEM Power Devices (Hefei) Co., Ltd, China

Discussion on key points of application of multi DIPIPMs in the same PCB
Kai Jiang
, Xiaoling Wang, Hongtao He, Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China

Variety of sensing method to reliably measure the switching loss of SiC/GaN devices in a small space and Issues
Ryu Nagahama
, Iwatsu Electric Co., Ltd, Japan

Power Modules

Power Modules: Implementing Solder-Reinforced Matrix-Preforms for Increased Reliability & Unique Inline X-Ray Algorithms to Eliminate False Void calls
Daniel Topan
, Nordson, Germany
Andreas Karch, Indium Corporation, UK

The Latest Generation Small Intelligent Power Module for Compact Inverter systems
Hidetomo Ohashi
, Tadanori Yamada, Takahiro Tamura, Akihiro Jonishi, Yasuyuki Kobayashi, Fuji Electric Co., Ltd., Japan
Song Chen, Fuji Electric China Co., Ltd., China

The 7th Generation Intelligent Power Module for Industrial Applications
Kenichirou Satou
, Kiyoshi Sekigawa, Naoki Shimizu, Kei Minagawa, Tatsuya Karasawa, Kaname Mitsuzuka, Takahiro Mori, Yasuyuki Kobayashi, Fuji Electric Co., Ltd., Japan
Song Chen, Fuji Electric (China) Co. Ltd., China
Massimo Caprioli, Fuji Electric (Europe) GmbH, Germany

Using Zth matrix model for more accurate Tvj calculation for IGBT power modules
Hao Zhang
, Lifeng Chen, Infineon Technologies Center of Competence (Shanghai) Co. Ltd., China Matthias Lassmann, Koray Yilmaz, Infineon Technologies AG, Germany

Research on the Feasibility of Industry LV100 Modules Applied in Onshore Wind Power Converters
Rui Zhao
, Yuancheng Zhang, Siqing Lu, Xiankui Ma, Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China

DC/DC and AC/DC

A novel power stack designed by half-bridge module with ANPC topology for a high-power offshore windpower converter
Heng Wang
, Infineon Integrated Circuit (Beijing) Co., Ltd., China
Hao Zhang, Infineon Technologies Center of Competence (Shanghai) Co. Ltd., China
Uwe Jansen, Infineon Technologies AG, Germany

A Novel Output Load Transient Optimization Approach for Multiphase VRM Design
Richard(Hua) Yang
, Texas Instruments, China

The Simultaneous Use of Two Alternative Neutral Point Current Paths in a 3-Level ANPC Topology – Benefits and Challenges in High Power Applications
Andreas Giessmann
, SEMIKRON Electronics (Zhuhai) Co., Ltd. Shanghai Branch, China
Christopher Schmidt, Matthias Spang, SEMIKRON Elektronik GmbH & Co. KG, Germany

A Novel Luenberger Observer for the Sensorless Speed Control of PMSM
Qianbao Mi
, Ruiqing Ma, Northwestern Polytechnical University, China

Research on silicon carbide devices used in PFC for DC EV charger applications
Ming Zhou
, Infineon Semiconductor (Shenzhen), China

Keynote

Circuit Protection with SiC FETs in dual-gate configuration
Anup Bhalla
, United Silicon Carbide Inc., USA

Special Session: Multilevel Converters

Topology, Modulation and Control of Multilevel Converters
Yongdong Li,
Tsinghua Hua University, CN

Neutral-Point Voltage Balancing Method for Diode-Clamped Four-Level Converters
Kui Wang
, Tsinghua University, CN

A transformer-less Motor Drive based on Back-to-Back MMCs with the Capability of Zero/Low-Speed High-Torque Operation
Jinjun Liu, Xi´an Jiaotong University, CN
Sixing Du, Xi´an Jiaotong University, CN

Modulation strategy with coordinated multi-control objective for three-level converter
Weidong Jiang
, Hefei University of Technology, CN

SiC and GaN Devices

3.3kV SiC Power MOSFETs with High-k Gate Dielectric
Lars Knoll
, Gianpaolo Romano, Andrei Mihaila, Hitachi ABB Power Grids Ltd., Semiconductors, Switzerland

The 2nd generation 650V SiC-SBD with low forward voltage drop and high surge current withstand capability
Yuichi Hashizume
, T. Uchida, N. Ohse, T. Kojima, T. Shimada, N. Iwaya, S.Watanabe, Y. Onozawa, M. Iwaya, Y. Agata, Y. Kobayashi, T. Shiigi, Fuji Electric Co., Ltd., Japan
C. Zhang, J. Li, Fuji Electric China Co., Ltd., China

1700V rated All SiC module with 2nd generation trench gate SiC-MOSFETs
Aiko Takasaki
, Tomoyuki Kani, Keiji Okumura, Rikihiro Maruyama, Yoshiyuki Kusunoki, Yasuyuki Kobayashi, Fuji Electric Co., Ltd., Japan Song Chen, Fuji Electric China, China

A study to use 600 V GaN HEMTs to drive motors
Jinsheng Song
, Infineon Technologies Americas Corp., USA

Automotive Power Electronics

Key Fatal Failures & Solutions in EV Power Magnetics
Antonio Rojas
, E. Navarro, C. Cañete, Miguel A Ariza, Premo Global Innovation Center, Spain

A compact solution of IGBT-module for traction inverter of EV
Lizhong Zhao
, Hongtao He, Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China

Low stray inductance automotive power module using SiC Chips and welded power terminals
Norbert Pluschke
, SEMIKRON (Hong Kong), HKSAR, China

Accurate Measurement of EV Range
Mitchell Marks
, Hottinger Bruel & Kjaer Co., Ltd, USA

Ultra-thin Dielectric Film for High Heat and High Voltage DC Link Capacitors
Adel Bastawros
, SABIC, USA

Power Devices and Reliability

TCL-based Parallel Study of 3.3kV Full SiC Power Modules
Jian Sun
, Bo Hu, Gaosheng Song, Mitsubishi Electric & Electronics (Shanghai) Co., Ltd., China

Silicon Nitride and Electric Vehicles
Xiaosi Wang
, Teda Tian&di IT Co. Ltd., China

Reducing Design-For-Manufacturing Complexity with Tool-Free Solder Preform Technology for Power Module Assembly
Joseph Hertline
, Timothy Jensen, Indium Corporation, USA
Andreas Karch, Indium Corporation, Germany
Aaron Hutzler, Bond Pulse, Germany
Leo Hu Yan Jie, Indium Corporation, China

Thermal Profile Variation and PCB Reliability
Jian Tian
, ZESTRON China, China
Umut Tosun, ZESTRON America, USA

Chinese session: Power Grid
中文专场:电网技术

Key Technologies and Equipment of Lightweight & Compact Full-DC Offshore Wind Power Collection and Transmission Converters
轻型化全直流海上风电汇集与送出变流器关键技术及装备研究
Dianguo Xu, Binbin Li
, Harbin Institute of Technology, CN
徐殿国,李彬彬,哈尔滨工业大学,中国

Advances of Novel DC Power Conversion Equipment for DC Grid Reconstruction
面向直流电网重构的新型直流变换装备理论与研究进展
Miao Zhu
, Shanghai Jiao Tong University, CN
朱淼,上海交通大学,中国

大容量电力电子装备的多物理场、多时间尺度联合建模与仿真方法
Bo Zhang
, South China University of Technology, CN
张波,华南理工大学,中国

Tutorial

The Opportunity and Solution of Magnetics for High-frequency Power Supplies
Wei Chen
, Fuzhou University, CN

Keynote

Challenges and Latest Achievements in Energy Efficient Solution for Data Center System
Alpha J. Zhang
, Delta Electronics Inc., CN

Chinese session: E-mobility
中文专场:电动交通

New techniques of EV on-board power supply and charger pile
电动汽车车载电源与充电桩新技术

Zhengshi Wang
, Zhejiang University, CN
王正仕,浙江大学,中国

Research and development of SiC-based high-speed motor drive inverter
基于SiC的高速电机逆变器研发
Zhihong Wu
, Tongji University, CN
吴志红,同济大学,中国

Infineon automotive CoolSiC™ supports your journey of electrification
英飞凌车规CoolSiC™助力您的电气化之旅
Peng Li
, Infineon Technologies (China) Co. Ltd., CN
李鹏,英飞凌,中国

Best of PCIM Europe digital days 2021

All SiC Module with 1700V Rated 2nd Generation Trench Gate SiC-MOSFETs
Alexander Theisen
, Fuji Electric Europe, D Aiko Takasaki, Keiji Okumura, Yoshiyuki Kusunoki, Yasuyuki Kobayashi, Tomojuki Kani, Rikihiro Maruyama, Fuji Electric, J

Comparison of Three Methods Gate Bias Reduction, Series Ballast Resistor and BaSIC(EMM) to Improve Short Circuit Capability of 1.2 kV SiC Power MOSFETs
Ajit Kanale
, Jayant Baliga, North Carolina State University, USA

Enhancement of Switching Performance and Output Power Density in 3.3 kV Full SiC Power Module Takahiro Morikawa, Seiichi Hayakawa, Kan Yasui, Tatsunori Murata, Koyo Kinoshita, Tetsuo Oda, Katsuaki Saito, Yuji Takayanagi, Hitachi Power Semiconductor Device, J
Toru Masuda, Hitachi Research Laboratory, J

Active Short Circuit Capability of HalfBridge Power Modules Towards E-Mobility Applications
Antoni Ruiz
, Milad Maleki, Athanasios Mesemanolis, Lluis Santolaria, Andreas Baschnagel, Hitachi ABB Power Grids, CH

Measures to Improve Efficiency, Peak Power Density and Current Density in an Automotive SiC Drive Train Inverter – Sensitivity Analysis of Design Parameters
Teresa Bertelshofer
, Stefan Hain, ZF Friedrichshafen, D
Cam Pham, Helong Li, CREE Europe, D
Alexander Streibel, Ole Mühlfeld, Danfoss Silicon Power, D

Evaluation of Quasi 2-level Modulation for MV Applications
Anatolii Tcai
, Thiwanka Wijekoon, Huawei, D
Marco Liserre, Christian-Albrechts-University, D

New Multi-Level Multiplexed Power Converter Topology for Medium-Voltage Power Drives
Vinicius Kremer
, Alain Lacarnoy, Schneider Electric, F
Thierry Meynard, LAPLACE University of Toulouse, F

Ideal Flyback Topology 
Ionel Dan Jitaru
, Rompower Energy System, USA
Andrei Savu, Bogdan Jitariu, Rompower International, RO
Constantin Radoi, Polytechnic Institute of Bucharest, RO

Registration

F56A1574

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