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PCIM
9 — 11 September 2021 Shenzhen, China More Info

Information for speakers

Participation fee for speakers

KIN_5349

Speakers (Industry)
Full Conference: RMB 1,500

Speakers (University Staff/Student)
Full Conference: RMB 750

* Full Conference includes all sessions, keynotes and the poster session across the show days.

Register now > PCIM Asia Conference Registration

List of speakers 2019

1
图2Foto_Haiyang Cao

Delta Power Electronic Center, China

Haiyang Cao was born in Hubei Province, China, 1986. He received the M.Sc. degrees in Electromobility from Chemnitz University of Technology, Chemnitz, Germany, in 2017 and the B.Sc. degrees in mechanical engineering from Dalian University of Technology, Dalian, China, in 2008.  

He is presently a Sr. engineer of Packaging Advanced Team in Delta Power Electronic Center, Shanghai, China. His current research interests include packaging technology and reliability in power modules.

3photo

Institute of Electrical Engineering Chinese Academy of Sciences, China

Han Cao is a Ph.D.  student in Institute of Electrical Engineering, Chinese Academy of Sciences. He has been working on power device modeling and high density converter design for 3 year.

Song Chen

Fuji Electric (China) Co., Ltd., China

Graduated in School of Electronic Information and Electrical Engineering from Shanghai Jiao Tong

University in 2008 and started working in Fuji Electric (China) Co., Ltd in 2010. Worked in R&D department

for evaluating of inverter during 2010~2011 and for designing of power stack for wind power during

2011~2012. And now works as application engineer for IGBT application design and technical support.

图5current photo-Siyang Dai

Dalian University of Technology, China

Siyang Dai was born in Liaoning Province, China, in 1991. She received the Master’s degree in electrical engineering from Dalian Jiaotong University, Dalian, China, in 2017.

Currently, she is a Ph.D. student of School of Electrical Engineering, Dalian University of Technology. She main research interest is multi physics field analysis and reliability of high-power electronics devices.

 

pic10 Gyan Dutt

MacDermid Alpha Electronics Solutions, United States


Gyan Dutt works for Alpha as Global Portfolio Manager for Die Attach Solutions. He is responsible for the planning, organization and implementation of ALPHA® product portfolio for Die Attach for power modules, inverters and LED applications. He has more than 15 years of experience in marketing, product development and applications engineering roles in semiconductor packaging in the US and Asia-Pacific Regions. He has an MS in Polymer Engineering from the University of Tennessee in Knoxville and an MBA from the University of California in Los Angeles.

Ming Gao

Shanghai Maritime University, China

Gao Ming, who received  bachelor's degree from Nanjing Normal University, is currently studying at Shanghai Maritime University.

Yueshi Guan

Harbin Institute of Technology, China

Yueshi Guan was born in Heilongjiang Province, China, in 1990. He received the B.S. degree and M.S. degrees in electrical engineering from Harbin Institute of Technology, China, in 2013 and 2015, respectively. He is currently pursuing his PH.D. degree in Harbin Institute of Technology, China. In 2018, he was a visiting graduate student in Princeton University. His research interests are in the areas of high frequency and very high frequency converters, single-stage AC/DC converter, and LED lighting systems.

pic.1 BO HU

Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China

Senior Engineer from Mitsubishi Electric & Electronics (Shanghai) Co., Ltd.

Akhtar Hussain Javed_white bcakground

CYG SUNRI Co., Ltd, China

Akhtar Hussain Javed is Electrical Engineer now working with CYG SUNRI CO. LTD as solution engineer for renewable energy products. In 2017, he did his postgraduate degree in Electrical Engineering from Xian Jiaotong University with major in Power electronics. He worked with distinguished IEEE fellow Prof. Liu JinJun in distributed control of microgrid team. His area of research is control of microgrid especially power sharing issue.

图11 Jianguang Ji

ZESTRON China, China

Mr. Jerry Ji is the senior proces engineer of ZESTRON Asia Pacific. He has more than 12 years working experiences in the cleaning sector of electronic assembly manufacturing industry. Before joining ZESTRON, he worked for several worldwide leading companies.

图12 Xun Jiang

Hefei University of Technology, China

Xun Jiang, Graduate student of Hefei University of Technology.  The research direction is single-phase power decoupling inverter, Inverter controller parameters identification and microgrid technology.

图13 Sungnam Kim

ON Semiconductor, Republic of Korea

He received the B.S. and M.S. degree in electrical engineering from Hanyang University, Korea, in 2002 and 2004, respectively. His major was switching mode power supply in power electronics.

He is currently Senior Principal application engineer of high voltage power MOSFET at ON semiconductor from 2006, Bucheon, Korea.

He had various application experiences about MOSFET, IGBT, Diode, Gate drive IC and Power module in LCD/PDP/LED TV, Audio power, Welding machine, Induction Heating and EV Charger.

His research interests is improving system efficiency, loss analysis, novel evaluation method and TCAD simulation of Power MOSFET.

 

图14 portrait photo, kangyoon lee

ON Semiconductor, South Korea


Kangyoon Lee received his M.S. degree in Electrical Engineering from SeoKyeong University, Seoul, Korea, in 2011.

From 2011 to 2016, he was with Fairchild Korea Semiconductor, Bucheon, Korea, where he was a R&D SPM Senior Research Engineer in the Motion Control System Team, HV PCIA. Since 2013, he has been working for ON Semiconductor as a IPM R&D Senior engineer in the IPM BU.

 

Li Jun - Tutorial Fuji

Fuji Electric (China) Co., Ltd., China


Li Jun received B.S. degree in mechanical engineering from South China University of Technology, China in 2003.

From 2003 to 2009.He engaged in development of switching power supply products in Sumida Electric (China) Co., Ltd.  

Since 2009, he joined Fuji Electric (China) Co., Ltd as a design engineer of general inverter. From 2011, he was transferred to Fuji Electric (China) semiconductor department, and contributor in building local semiconductor application engineering department. 

His current responsibilities include various power ranges of power semiconductor module for industry, renewable energy and electrical vehicle applications.

 

图16 current photo_MengYu Li

Infineon Integrated Circuit (Beijing) Co., Ltd.

Mengyu Li was born in Xi'an, China, on April 11th, 1998. She will receive her B Sc. Degree in Xidian University in 2019. She work in Automotive System Engineering department of Infineon Integrated Circuit (Beijing) Co., Ltd from August 2018. Her research interest includes Switch Mode Power Supply IC design.

Liu Chunlei

ABB Corporate Research, Switzerland

Cheng Liu is in charge of the technical marketing department at BASiC Semiconductor. He have 2 years development experience of IGBT driver and 5 years experience of technical support at BRONZE Technologies. He graduated from Hubei University in 2011, he has the wide experience in semiconductor device, IGBT driver development and electronic system design.

Xiaoming Liu

Semikron Electronics (Zhuhai) Co., Ltd, China

Major in mechanical and electronic engineering and have more than 5 year experiences in IGBT drive design and IGBT test.  Familiar with IGBT modules application and IGBT drive design. 

图19 Xiankui Ma

Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China

Ma Xiankui obtained his Master degree in Engineering from Hefei University of Technology in 2001. He joined Emerson as UPS hardware R&D engineer in 2001. From 2007, he starts to work for Mitsubishi Electric Semiconductor Great China(MEGC), mainly responsible for the technical support work. Currently, he is experienced at researching power devices related technologies. He is actively supporting power device applications in industry and renewable energy.

Xiangfei Meng

Danfoss Silicon Power, China

Meng Xiang Fei received the bachelor degree in automation in 2010 and Master degree in control theory and control engineering in 2012 from Northeastern University. After graduation, he worked as a power electronics engineer, was responsible for wind turbine inverter development. After that, he joined Infineon and took charge of power stack customer support and failure analysis. He got best YIP of Infineon and incredible reward from company. He together with his team won Infineon IPC LEADs award Munich 2015 for his outstanding work. Now, he works for Danfoss Silicon Power takes charge of Chinese market technical support and customized power module development.

pic.2 HidetomoOHASHI

Fuji Electric Co.,Ltd., Japan

Graduated in school of applied chemical from university of Tokyo in 2002 and started working in Fuji Electric  Co., Ltd in 2002. Worked in R&D department for IC engineer of power supply during 2002~2010. Now works as power module engineer of new IGBT IPM development for inverter applications. And enrolled in a doctoral course in university of Yamanashi.

pic.6 Zihe Peng

Nanjing University of Aeronautics and Astronautics, China

Zihe Peng is currently pursuing the M.S. degrees in  college of automation engineering from the Nanjing University of Aeronautics and Astronautics,  Nanjing, China.

His research interests include power conversion technology.

图23 Haihong Qin

Nanjing University of Aeronautics and Astronautics, China

Haihong Qin received the B.S. and M.S. Degrees in college of automation engineering from the Nanjing University of Aeronautics and Astronautics,  Nanjing, China.

His research interests include wide band-gap devices and its application in motor drive.

图24 Dr. Likun Shen

Transphorm Inc., USA

Dr. Likun Shen joined Transphorm in 2007 as a member in founding team and is presently a Sr. Member of Technical Stuff and Director of Product Engineering. He is in charge of the product development for GaN high power devices. Dr. Shen received his Ph.D. degree from UC Santa Barbara in 2004. He has worked in GaN-based microwave and power devices fields for 20+ years and has many contributions to the development of GaN HEMTs included the novel passivation method, novel epitaxial structure and processing technologies. He has authored and coauthored more than 70 papers in technical journals and international conferences, as well as 7 patents awarded or in pending.

图25 Tian Bryan final

Infineon Technologies, China

Bryan Tian is currently a Sr. staff application engineer at Industrial Power Control department of Infineon Technologies China. Bryan received the M.S. degrees in power electronics from Hua Zhong University of Science and Technology in 2004. He has rich experience of the SMPS and motor drive system design. Now Bryan is in charge of the IGBT application supporting at North China.

图26 Changgeng Tian

China University of Mining & Technology, China

Changgeng Tian is a doctoral candidate at China University of Mining & Technology, Beijing. He received his Bachelor's degree in Electrical Engineering from North China Institute of Science and Technology, Beijing, China, in 2012. He received an Master degree in Electrical Engineering from China University of Mining & Technology, Beijing, China, in 2017 and began his doctorate in the same year. His general research interests are in the area of Static Var Compensator, Static Var Generator, Active Power Filter, Unified Power Quality Conditioner. In particular, his current research focuses on unidirectional power flow convertor and its applications.

图27 Yuki Tono

Osaka Institute of Technology, Japan

Yuki Tono is currently a senior student in Osaka Institute of Technology, Japan, and belongs to power electronics laboratory.

He presently studies bidirectional WPT for wireless V2H system, and development of SiC-MOSFET for single-ended converters.

 

图28 Evgeny Tsyplakov

ABB Switzerland Ltd., Switzerland

Mr. Evgeny Tsyplakov Male, born 1964 in Uzhno-Sakhalinsk, Russia, Global Product Specialist. Mr. Tsyplakov graduated from Moscow Institute of Railway Transport (MIRTE), Worked as scientific researcher at MIRTE. Mr. Tsyplakov joined ABB Semiconductors in 1994 with main duty on Design, Qualification and Application of high power semiconductors.

图29 Baoqi Wang

Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China

Baoqi Wang works for MITSUBISHI ELECTRIC & ELECTRONICS (SHANGHAI) CO., LTD as a Field Application Engineer since 2016. The main job responsibility is focusing on the application and promotion of EV power devices in China.

pic.5 Hao Wang

Power Integrations, China

Hao Wang was born in 1985, received his Master degree in Power Electronic Engineering from Shanghai Maritime University (China). Since 2011 he had the opportunity to make experiences in R&D position designing converter systems for Solar, UPS, and Medium Voltage Drives at Emerson Network Power Company. Since 2016 he is working as an application engineer at the Gate Drivers department of Power Integrations in Shenzhen (China).

图31 Photo of Xiaoling Wang for PCIM 2019

Mitsubishi Electric & Electronics (Shanghai) Co., Ltd, China

Xiaoling Wang works for MITSUBISHI ELECTRIC & ELECTRONICS (SHANGHAI) CO., LTD as a Field Application Engineer since 2007. The main job responsibility is focusing on the application and promotion of power devices such as IGBTs and IPMs in China. 

Worked as a R&D engineer for Qingdao Haier A/C Electronic CO., LTD from 1997 to 2002. 

图32 TU_Dresden-Stefan_Wettengel

TU Dresden, Germany

Stefan Wettengel was born in Oelsnitz/Vogtl., Germany, in 1988. In 2014 he received a diploma degree in electrical engineering from TU Dresden, Dresden, Germany. He is currently working as a Ph.D. student at TU Dresden, where he is involved in a research project designing a novel pulsed current converter as a driver for high-field solenoids for medical applications.

33 Photo_AotoYamamoto

Osaka Institute of Technology, Japan

Aoto Yamamoto is currently a graduate student in Osaka Institute of Technology, Japan, and belongs to power electronics laboratory.

He presently studies bidirectional WPT for wireless V2H system, and development of SiC-MOSFET for single-ended converters.

He is a member of the institute of electrical engineers in Japan and IEEE.

图34 Kohei Yamauchi

Fuji Electric Co., Ltd, Japan

Kohei Yamauchi is an engineer in Fuji Electric. He follows IGBT modules for automotive application. He mainly developed IGBT module with direct water cooling.

图35 SungMo Young

Infineon Technologies Korea, South Korea

Sungmo Young received B.S. and M.S. degrees from Hanyang University, Seoul, Republic of Korea, in 1998 and 2000, respectively. Since 2000, he has been an application engineer of power semiconductors. He is currently working as IPM technical marketing at Infineon Technologies Korea.

36 yuan

Institute of Electrical Engineering Chinese Academy of Sciences, China

YuanTianshu, who graduated from Shandong University in 2016, now is with Institute of Electrical Engineering, University of Chinese Academy of Sciences, Chinese Academy of Sciences. My major is power electronics and power transmission.

图37 elvis zeng

ON Semiconductor, China

Elvis Zeng was born in Jiangxi in November 1966, he has received the Bachelor degree in electrical automation from HeNan Science University in 1986. He has been worked in ASA semiconductor in Singapore as software engineer and AMD as product development engineer, he joined Fairchild semiconductor (currently ON semiconductor) in Suzhou as Senior characterization test engineer 11 years ago, and familiar with characterization of diode, MOSFET and IGBT, currently leading application test in solar application.

图38 Wenjing Zhang, ONSemi

ON Semiconductor, China

Wenjing Zhang, Ph.D. works as Principal Application Engineer at ON Semiconductor in the DC-DC Power Solutions Business Unit. His field of expertise includes switch-mode power supplies and power semiconductor devices electrical-thermal modeling. SPICE/Matlab simulations are also a strong-part of his knowledge. He has over 10 years of power semiconductor industry experience. He received his Ph.D. in Microelectronics and Solid State Electronics from The Graduate University of Chinese Academy of Sciences, China.

39 Zheng Zi Qing

Infineon China, China

Zheng Zi qing was born in Shanghai, China in October 1982. She received the Master degree from Shanghai Maritime University of Shanghai, China in 2007. She joined Infineon Technologies China in August 2007 as Application Engineer, major responsibilities are IGBT dynamic test, IGBT adapter board design and thermal test

图40 Liwei Zhou

Infineon Technologies China Co.,Ltd, China

Mr. Liwei Zhou, graduated from Shanghai Maritime University with Master’s degree on Power Electronics & Electric Drives in 2007. Then he worked for Shanghai Electric Xantrex Power Electronics Co. Ltd. for three years as R&D engineer responsible for wind power converter development and localized production. 

In 2010, he joined GE (China) Technology Center as the product engineer, providing technical support to wind turbine production line and failure mode analysis on component level and engaged in LVRT retrofit solution making for GE wind turbines. 

In August of 2012, he joined Infineon Technologies China Co. Ltd. as a senior application engineer and has served Infineon for ~7 years till now. He is currently responsible for IGBT modules and discrete technical support to the customers located in Middle & East of China area.

图41 Zhu Dan

SEMIKRON Electronics (Zhuhai) Co., Ltd, China

The speaker has studied the advanced semiconductor analysis methods both China and international and systematically summarized and collated them in her work. She has more than 10 year experience about how to improve in both product quality and application.

Fengjie Zhu

Semikron Electronics (Zhuhai) Co., Ltd, China

Majored in Electrical Engineering and automation and have more than 17-year experiences in field of power electronics design and application.  Have been working for SEMIKRON China as Field Application Manager since 2012. Familiar with Thyristor, IGBT and rectifier module application.